LeEco shows off it’s new flagship with Dual Camera

LeEco Le X850

Recently LeEco claimed to launch a device with the all new Snapdragon 823 processor, but that’s not going to happen as Qualcomm introduced Snapdragon 821 as the successor of the all powerful Snapdragon 820. We can expect this new flagship will launch with the new Snapdragon 821 processor which is just 10% more powerful than the Snapdragon 820 in RAW speed.

Leaks don’t reveal the name of  the device, but I don’t think that its time for a Le3 or a Le Max 3, we can expect it as Le Max 2 Pro or Le 2 Plus….sounds confusing but they can do that, or may they go for a new range of devices except Le and Max (Maybe?) as the Model No listed is LeX720.


LeEco-dual-cameras-2The design is pretty much like the predecessors Le 2 and Le Max 2 a big camera hump (now have two cameras and dual tone flash in it) a big curved fingerprint sensor beneath the camera…s (probably snapdragon ultrasonic scanner).

The interesting change in the design is antenna bands looks like LeEco is getting the ideas from the other big brands with which they compare…*cough*.

They also changed the front now we have a Le logo instead of a squared virtual home button and the bezel-less ID 2.0 is the same as before.


It’s not yet cleared that what is powering the weird looking Dual Camera device but I am pretty sure that it will come in two or more variants one with the 4GB RAM (the Entry Level) the other one with 6/8GB RAM, and speaking of power Xiaomi claims that they will launch the first device with Snapdragon 821.LeEco-dual-cameras-6

So, this device could be powered by the budget Snapdragon 652 or less likely with Snapdragon 821.

So what you guys think about this leak, did you like the new design *sort of* and the wired placement of the Dual Cameras, tell us in the comments below and don’t forget to share this with your friends and do like us on Facebook and Twitter for more info on this and much more.


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